Copper ≥99.995% (metals basis), sputtering target, Ø 50.8 mm (2.0 in), Thickness: 6.35 mm (0.250 in)
Supplier: Thermo Scientific
43039.KSEA
456
EUR
43039.KS
Copper ≥99.995% (metals basis), sputtering target, Ø 50.8 mm (2.0 in), Thickness: 6.35 mm (0.250 in)
Copper
Formula:
Cu MW: 63,55 g/mol Boiling Pt: 2595 °C (1013 hPa) Melting Pt: 1083 °C Density: 8,94 g/cm³ (20 °C) |
MDL Number:
MFCD00010965 CAS Number: 7440-50-8 Merck Index: 13,02545 |
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