Copper ≥99.995% (metals basis), sputtering target, Ø 50.8 mm (2.0 in), Thickness: 6.35 mm (0.250 in)

Supplier: Thermo Scientific

43039.KSEA 456 EUR
43039.KS
Copper ≥99.995% (metals basis), sputtering target, Ø 50.8 mm (2.0 in), Thickness: 6.35 mm (0.250 in)
Copper
Formula: Cu
MW: 63,55 g/mol
Boiling Pt: 2595 °C (1013 hPa)
Melting Pt: 1083 °C
Density: 8,94 g/cm³ (20 °C)
MDL Number: MFCD00010965
CAS Number: 7440-50-8
Merck Index: 13,02545

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